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Rotatable Al Sputtering Target

Rotatable Al Sputtering Target

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Product name

Rotatable Al Sputtering Target

Chemical Composition: Al
Molding process: Spray
Purity: ≥2.6g/cm3 (≥96%)
Density: ≥99.9%-99.99%
Application: Widely used in decorative & functional coating, semiconductor electronics , TFT-LCD
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Product description
Product parameters

纯度:   

Al

喷涂

≥ 2.6g/cm³(≥96%)

≥ 99.9%-99.99%(根据客户需求)

化学式: 

成型工艺: 

密度:  

≤200

最大杂质含量(单位: ppm,总杂质含量≤1000ppm)

Fe

≤300

Cu

≤100

Ni

≤100

Sn

≤50

O

≤1500

N

Zn

≤50

 

Rotatable Al Sputtering Target

最大加工尺寸: 

长度L: 4000MM    厚度T: 6-15MM

直型、狗骨型

按客户要求定做

 

旋转铝靶 

产品化学成分和物理性能:

应用: 

主要用于表面装饰及功能镀膜,半导体电子, TFT-LCD, 平面显示,薄膜太阳能行业

 
 
 
 
Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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