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Rotatable Al Sputtering Target
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Product name
Rotatable Al Sputtering Target
Molding process: Spray
Density: ≥2.6g/cm3 (≥96%)
Purity: ≥99.9%-99.99%
Application: Widely used in decorative & functional coating, semiconductor electronics , TFT-LCD
Serial number
Affiliate classification
Rotatable Target
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Product description
Product parameters
纯度:
Al
喷涂
≥ 2.6g/cm³(≥96%)
≥ 99.9%-99.99%(根据客户需求)
化学式:
成型工艺:
密度:
≤200
最大杂质含量（单位: ppm，总杂质含量≤1000ppm）
Fe
≤300
Cu
≤100
Ni
≤100
Sn
≤50
O
≤1500
N
Zn
≤50
Rotatable Al Sputtering Target
最大加工尺寸：
长度L: 4000MM 厚度T: 6-15MM
直型、狗骨型
按客户要求定做
旋转铝靶
产品化学成分和物理性能：
应用:
主要用于表面装饰及功能镀膜，半导体电子, TFT-LCD, 平面显示，薄膜太阳能行业
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