PRODUCT
Chemical Composition: Si
Resistivity(20°C): 0.01-400Ω. cm
Molding process: Spray
Purity: ≥2.26g/cm3(≥96%)
Density: ≥99.95%
Application: Mainly used for producing SiO2/Si3N4 film, mainly used in Op
Resistivity(20°C): 0.01-400Ω. cm
Molding process: Spray
Purity: ≥2.26g/cm3(≥96%)
Density: ≥99.95%
Application: Mainly used for producing SiO2/Si3N4 film, mainly used in Op
Chemical Composition: Al
Molding process: Spray
Purity: ≥2.6g/cm3 (≥96%)
Density: ≥99.9%-99.99%
Application: Widely used in decorative & functional coating, semiconductor electronics , TFT-LCD
Molding process: Spray
Purity: ≥2.6g/cm3 (≥96%)
Density: ≥99.9%-99.99%
Application: Widely used in decorative & functional coating, semiconductor electronics , TFT-LCD
Chemical Composition: Cu
Molding process: Spray
Purity: ≥8.57g/cm3 ( ≥ 96%)
Density: 99.9%-99.99%( according to customer requirements)
Application: Mainly used for producing pure Cu film, widely used
Molding process: Spray
Purity: ≥8.57g/cm3 ( ≥ 96%)
Density: 99.9%-99.99%( according to customer requirements)
Application: Mainly used for producing pure Cu film, widely used
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